Alpha® Blog
Low-Silver, Lead-free Solders.
Posted on: March 20, 2012
by Mitch Holtzer
Head-in-pillow defects, or incomplete coalescence of BGA sphere and solder paste deposit, is a failure mode that has seen increased frequency since the transition to lead-free soldering.
Posted on: November 01, 2011
by Mike Murphy
The world of electronics manufacturing changed on July 1, 2006, when the EU prohibited the use of lead-based solders in many electronics. Decades of experience had produced advanced soldering technologies, metallurgy, and processes. Then everything changed.
Posted on: January 01, 0001
by Test Author
Many electronic assemblies require two SMT reflow steps, followed by a wave soldering process. With lead-free assemblies, the wave soldering step is required to prevent damage to temperature sensitive components like connectors, audio visual jacks, and electrolytic capacitors.
Posted on: October 19, 2011
by
Conformal coatings are used to protect electronic assemblies that may be subjected to exposure to potentially harmful vapors and/or liquids. Conformal coatings come in various chemistries, each with its advantages and disadvantages. Urethanes, epoxies, acrylics and parylene are among the most popular chemistries used on electronic assemblies.