ALPHA® Exactalloy Tape & Reel Packaged Solder Preforms Create Value!

ALPHA® Preforms provide an easy to Implement method for increasing solder volume. They are specifically targeted for use with solder paste in electronic assembly applications.

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ALPHA® SACX Plus® Alloys Create Value

The SACX Plus® family of RoHS-compliant alloys helps optimize the value of your assemblies. They are easy to use, deliver excellent soldering performance and are highly reliable.

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ALPHA© CVP-520 Solder Paste Enables ALPHA's Dual Alloy SMT Process™

Now you can reduce your mixed-technology process to a two step SMT-only process using CVP-520, a PB-free, low temperature Solder Paste.

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Alpha® Telecore XL-825 Cored Solder Wire Provides Superior Performance.

Alpha® Telecore XL-825 Cored Solder Wire Provides Superior Wetting Speed and Low-Splatter Soldering Performance. Now you can achieve excellent manual and drag soldering results.

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ALPHA® Stencils - Optimizing Paste Deposits

Alpha solder paste stencils fulfill today’s challenging printing requirements with fast response, high accuracy, excellent printing performance and worldwide availability.

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Alpha Solder Paste Addresses Head in Pillow Defects

Posted on March 20, 2012

by Mitch Holtzer

Head-in-pillow defects, or incomplete coalescence of BGA sphere and solder paste deposit, is a failure mode that has seen increased frequency since the transition to lead-free soldering.

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May 22-24 2012

Strategies in Light China 2012

Shenzhen, China

Tokyo, Japan

Chengdu, China

May 16, 2012: Alpha LED Technologies to Attend Strategies in Light China 2012
May 15, 2012: Alpha LED Technologies to Present at the Carolinas Expo and Tech Forum 2012
April 23, 2012: Alpha Presents at IMAPS Device Packaging Conference

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